Thick-film Hybrid Integrated Circuit Market Size (2023 – 2030) 

The global thick-film hybrid integrated circuit market is projected to grow from USD 1.46 billion in 2022 to USD 2.60 billion by 2030, at a CAGR of 7.5%. A semiconductor device with characteristics of both monolithic and hybrid integrated circuits is known as a thick-film hybrid integrated circuit (TFHIC). A TFHIC is created by connecting a tiny layer of silicon to a layer of ceramic that is thicker than the silicon, and then removing the silicon to reveal the circuitry that is needed. While maintaining the benefits of hybrid integration, such as better reliability and manufacturability, this construction method enables greater downsizing and higher density than conventional monolithic circuits.

Thick-film Hybrid Integrated Circuit Market Drivers –

• The market for thick-film hybrid integrated circuits is expanding due to the benefits of thick-film technology, including the ability to choose desired resistance values, resistance compositions, and measurements, as well as thick-film hybrid integrated circuits' low cost. –

The demand for high performance and miniaturisation in electronic devices, for innovative semiconductor packaging solutions, and for thick-film hybrid integrated circuits in a variety of applications, including avionics and defence, automotive, telecom and computer industry, and consumer electronics, are all contributing factors to the market's growth.

• One of the key drivers of this market is the increasing demand for high-performance electronic devices –

TFHICs are able to offer improved performance compared to traditional integrated circuits due to their ability to operate at higher temperatures and higher frequencies. This makes them particularly well-suited for use in a wide range of applications, including military and aerospace, automotive, and telecommunications.

• The growth of the IoT market is also driving the demand for TFHICs –

As the number of connected devices continues to grow, there is a need for microelectronic devices that can handle the increased data traffic and power requirements. TFHICs are able to offer improved data processing capabilities and power management capabilities, making them well-suited for use in IoT applications.

Thick-film Hybrid Integrated Circuit Market Challenges –

• The market expansion for thick-film hybrid integrated circuits may be constrained by the larger size and slow speed of these ICs.

TFHICs may face competition from other types of integrated circuits that offer similar performance at a lower cost. For example, microelectromechanical systems (MEMS) and silicon-on-insulator (SOI) technologies have gained popularity in recent years, and may offer similar performance to TFHICs at a lower cost.

• One major challenge is the high cost of production which is limiting the growth of the TFHIC Market –

TFHICs are produced using complex manufacturing processes that require specialized equipment and materials. This makes them more expensive to produce than other types of integrated circuits, which can make them less appealing to cost-sensitive customers.

Thick-film Hybrid Integrated Circuit Market Opportunities –

• One of the major opportunities in the TFHIC market is the growing demand for TFHICs in the medical sector which will be a huge opportunity for companies –

TFHICs are used in various medical devices such as pacemakers, insulin pumps, and drug delivery systems, which require high performance and reliability. The increasing demand for advanced medical devices is projected to drive the TFHIC market in the medical sector.

• The TFHIC market is facing increasing demand for TFHICs in the military and aerospace sector and industrial control sector –

TFHICs are used in various military and aerospace applications such as radar systems, guidance systems, and missile systems, which require high performance and reliability. The increasing demand for advanced military and aerospace technologies is projected to drive the TFHIC market in these sectors. TFHICs are used in various industrial control systems such as process control systems, robotics, and automation systems, which require high performance and reliability. The increasing demand for advanced industrial control systems is projected to drive the TFHIC market in the industrial sector.

COVID-19 Impact on Thick-film Hybrid Integrated Circuit Market –

The COVID-19 pandemic has had a significant impact on the thick-film hybrid integrated circuit market. One major impact has been a slowdown in the production and demand for electronic devices, as lockdowns and economic downturns have led to reduced consumer spending. This has resulted in lower demand for thick-film hybrid integrated circuits, as they are used in a wide range of electronic devices such as smartphones, laptops, and medical equipment. Another impact has been supply chain disruptions, as the pandemic has caused delays and disruptions in the transportation of raw materials and finished products. This has led to increased costs and delays in the production of thick-film hybrid integrated circuits. Additionally, the pandemic has led to a shift towards remote work and online education, leading to increased demand for electronic devices and potentially boosting the demand for thick-film hybrid integrated circuits in the long term. Overall, the COVID-19 pandemic has had a mixed impact on the thick-film hybrid integrated circuit market, with both negative and positive factors at play.

Thick-film Hybrid Integrated Circuit Market Recent Developments –

• In 2021, Murata Manufacturing Co. Ltd. announced the launch of its new series of high-power thick-film hybrid integrated circuits (THICs) for use in automotive and industrial applications. These THICs offer high current and voltage ratings, as well as improved reliability and durability.
• In 2020, Honeywell International Inc. introduced its new line of thick-film hybrid integrated circuits for use in aircraft and aerospace applications. These THICs are designed to withstand extreme temperature and vibration conditions, making them suitable for use in high-stress environments.
• In 2019, TT Electronics announced the release of its new series of thick-film hybrid integrated circuits for use in medical device applications. These THICs offer high levels of accuracy and reliability, making them suitable for use in critical medical equipment.
• In 2018, TTM Technologies announced the acquisition of Anaren, a leading manufacturer of thick-film hybrid integrated circuits. This acquisition has allowed TTM Technologies to expand its capabilities in the THIC market and offer a wider range of THIC products to its customers.

THICK-FILM HYBRID INTEGRATED CIRCUIT   MARKET REPORT COVERAGE:

Thick-film Hybrid Integrated Circuit Market Segmentation – By Type:

• Al2O3 Ceramic Substrate
• BeO Ceramic Substrate
• AIN Substrates
• Other Substrate

Al2O3 Ceramic Substrate: For the production of integrated circuits, al2o3 ceramic substrate is a low-growing, non-toxic, and secure material (IC). It helps to keep the circuit temperature constant thanks to its high thermal conductivity and specific heat capacity. Additionally, the product gives printed circuit boards (PCB) mechanical stability and serves as an insulator during electrical transmission.

BeO Ceramic Substrate: BeO is a ceramic substance with a high specific heat capacity. Additionally, it is oxidation and corrosion resistant. Modern thin-film integrated circuits are produced on substrates based on BeO. (IC). Along with other parts like capacitors and resistors that make up an IC's electronic circuit, the product finds use in RF, microwave, sensors, and actuators.

AIN Substrates –

A thin-film hybrid integrated circuit (TFHIC) from AIN Substrates combines the advantages of thick film and thin film technology. Compared to conventional thick film ICs, it consumes less power, performs better, and lasts longer while maintaining the adaptability and affordability of thin film technology.

Thick-film Hybrid Integrated Circuit Market Segmentation- By Application:

• Avionics and Defense
• Automotive
• Telecoms and Computer Industry
• Consumer Electrons

With more than 40% of the global market, the telecom and computer sector was the largest application segment in 2022. The rise in demand for thick-film hybrid integrated circuits from telecommunications providers and computer manufacturers is responsible for the surge. During the projection period, rising smartphone demand is also anticipated to support overall growth. Due to increased demand from nations like China, India, and South Korea, where price-competitive products have drastically lowered prices compared to other economies globally, the consumer electronics industry is anticipated to rise substantially during the projection period.

Thick-film Hybrid Integrated Circuit Market Segmentation- By Region:

• North America 
• Europe 
• Asia Pacific 
• Middle East 
• Latin America 

In 2022, the Asia Pacific region held the top regional market position and contributed more than 40% of worldwide revenue. Due to rising demand from the consumer electronics, automotive, and aerospace & defence industries, the area is anticipated to maintain its dominance during the projection period. Positive government initiatives, like the Make in India initiative, are also anticipated to increase local production levels, which would further fuel industry growth. The aerospace and defence industry is projected to expand at a CAGR of 7.5% from 2023 to 2028, primarily as a result of rising military expenditures and technological advancements in a variety of aircraft models produced by Airbus S.A., Rolls-Royce Group PLC, Dassault Aviation SA, Thales Group, and Leonardo Helicopters SPA. Furthermore, over the next five years, the need for power electronics will grow as a result of Europe's rapidly expanding capacity for the generation of renewable energy.

Thick-film Hybrid Integrated Circuit Market Key Players –

1. Advance Circuit Technology, Inc.
2. Cermetek MicroElectronics, Inc.
3. Emtron Hybrids Inc.
4. Infineon Technologies AG
5. Integrated Technology Lab, Inc.
6. InterFET
7. Japan Resistor Mfg. Co., Ltd.
8. Kolektor Siegert GmbH
9. Semtech Corporation
10. Technograph Microcircuits Ltd.Top of Form