Global Thermal Copper Pillar Bump Market Size (2023 – 2030)

In 2022, the Global Thermal Copper Pillar Bump Market was valued at USD 1.3 billion and is projected to reach a market size of USD 2.12 billion by 2030. Over the forecast period of 2023-2030, the market is projected to grow at a CAGR of 6.3%.

Industry Overview:

The thermal copper pillar bump, also referred to as the "thermal bump," is a thermoelectric component used in flip chip interconnects (specifically copper pillar solder bumps) for electronics and optoelectronic packagings, such as flip chip packaging of CPU and GPU integrated circuits (chips), semiconductor optical amplifiers (SOA), and laser diodes. In contrast to traditional solder bumps, which offer an electrical channel and a mechanical connection to the package, thermal bumps work as solid-state heat pumps and add local thermal management capabilities to the surface of a chip or another electrical component. The issues that flip chip packages encounter as the bump pitch size continues to decrease can be addressed with copper pillar bumping, which is a viable approach. A common type of flip chip interface that gives benefits in many designs while satisfying present and future ROHS regulations is the copper pillar bump. For applications requiring a blend of fine pitch, ROHS/Green compliance, low cost, and electromigration performance, such as embedded processors, transceivers, application processors, power management, ASICs, baseband, and SOCs, it is a great connectivity option. By using TCFC (Thermal Compression Flip-Chip) technology, copper pillars are terminals that are used to "flip-chip" IC chips to a substrate in a semiconductor package. On the aluminum electrode pads of an IC chip, copper pillars are created. Due to an increase in pin count with tiny pad pitches integrated on an IC chip, copper pillar interconnects are in increased demand. Through the use of fine plating pattern formation techniques, uniformly sized copper pillars may be created on silicon wafers.

The increasing need for high connectivity devices, technological superiority over wire bond connections, capacity to maintain high package densities and rising circuit durability are some of the market-driving drivers. The development of copper pillar and micro bumping metallurgy, as well as its widespread use in consumer electronics and mobile phones, are driving up demand for flip-chip technology at the moment. The most cutting-edge manufacturing methods are supported by current bumping techniques, allowing the flip-chip process to be changed to address new issues. The market for flip-chip technology is expanding due to rising consumer, computer, and mobile wireless application demand. Flip chips are mostly used in electrical connections and electronic packaging. The Copper Pillar Bump is a new flip-chip interconnect that offers design benefits to satisfy both present-day and foreseeable demands for electronic devices. Flip chip has also transformed the markets for portable devices and electric vehicles by establishing itself as the optimum product for electrical interconnections. One of the main elements influencing the market's outlook favorably is the global electronics industry's rapid rise. For device downsizing, increased electrical efficiency, and low power consumption, flip-chip technology is widely used in consumer electronics and robotic applications. Additionally, several technical developments, including the Internet of Things (IoT) integration of linked devices and the use of flip-chip technology for enhanced microwave and ultrasonic operations, are helping the industry expand. The market is estimated to rise as a result of several other reasons, such as the expanding need for circuit miniaturization in microelectronic devices and intensive research and development (R&D) efforts.

COVID-19 pandemic impact on Thermal Copper Pillar Bump Market

In recent years, the global thermal copper pillar bump market has experienced rapid revenue growth; however, the market has recently seen a sharp fall as a result of the important electronics manufacturing industries being temporarily shut down, largely to stop the spread of COVID-19. Additionally, this pandemic has had a significant effect on the global supply chain by affecting suppliers through shortages of components, materials, and finished goods as well as by lowering consumer spending in China on products that depend on semiconductors, such as consumer electronics, automobiles, and other products. The long-term shutdown in China caused by the COVID-19 epidemic has an impact on all production bases and industries there, which has an impact on the market for flip-chip technology. As a result, the global supply chain model must be changed in the semiconductor industry, which is predicted to have a favorable effect on the market's growth in the future.

MARKET DRIVERS:

An increase in the demand for high-frequency applications and a rise in the necessity for circuit miniaturization in microelectronic devices both contribute to the market's expansion

The adoption of thermal copper pillar bump in microelectronic devices is driven by the rise in demand for smaller electronic devices, increased electrical efficiency, and reduced power consumption. Flip chips are used more frequently in the microwave and ultrasonic operations because they improve the efficiency of electrical machinery that runs at high frequencies. Flip chips' widespread use in electrical gadgets is driven by these particular characteristics. Additionally, it is anticipated that during the projected period, continuous R&D initiatives by key competitors in the global market would present new growth possibilities for the thermal copper pillar bump market. In December 2021, Thomasnet introduced Hi-Watty Light, a high-tech method for contacting microelectronic components without housing that has applications in the flip-chip assembly and automated semiconductor test systems for automotive engineering. Additionally, it can be applied to the semiconductor, medical, automotive, and aerospace industries. As a result, increasing miniaturization demands are encouraging the usage of flip chips across a variety of industries, which is fueling the expansion of this market. On the other hand, it is anticipated that technical advances made possible by facilities for research and development and investments made by major market players will present lucrative chances for the growth of the overall market. The widespread usage of flip chips in communications applications such as network systems, cellular base stations, optoelectronics, telecommunication switching, and wireless goods is another factor fueling the market's expansion.

The market's expansion is being fueled by technological advancements in wire bonding.

Due to their improved qualities, including their compact size, robust structure, increased efficiency, and high-frequency application support at a relatively low cost, flip chips have gradually replaced wire bonding packaging. Wire bonding is currently becoming more and more common in the packaging industry. Flip chips, however, are replacing wire bonded technology due to their remarkable qualities, including higher I/O capability, superior thermal & electrical performance, and substrate flexibility for varying performance requirements. As a result, the flip-chip market forecast is estimated to experience rapid growth in the future. Flip chips have been pushed to take the place of wire bond technology in products like cellphones, PC processors, and gaming consoles as a result of these criteria. Additionally, a surge in the utilization of flip chips in modern electronics is anticipated to accelerate the expansion of the thermal copper pillar bump market in the future.

MARKET RESTRAINTS:

The market's expansion is hampered by the usage of additional wafer bumping and more expensive substrate.

The main obstacle to the widespread use of thermal copper pillar bump is the high cost of the packaging solutions for flip chips, which are produced by suppliers of wafer manufacturing, substrate, and assembly/packing services. Due to their incredibly sophisticated architecture and small size, these chips' number of input and output ports cannot be altered after manufacturing. Thus, these elements taken as a whole prevent the market from expanding. The flip-chip package is no longer a viable alternative for customers due to the increased costs of production and packaging. By providing flip-chip packaging alternatives on standard bis-maleimide triazine resin substrates, quad flat pack no leads (QFN), and standard lead frames (FCSOL), the packaging and assembly companies have taken efforts toward giving cost-effective solutions.

The need for extremely flat surfaces for heat dissipation and the bumping of beads cause stiff and short beads to be prone to shattering

Flip Chips bump and flip semiconductor die onto substrates to connect them to the substrate. Directly on the input-output pads of the die, bumps are often arranged in an array covering the full die surface. Since the chip and circuit board are directly connected, the wire is shorter, which reduces resistance and speeds up the signal transmission. However, these close-spaced bumps lack mechanical strength and are susceptible to cracking at higher temperatures in the event of a thermal expansion mismatch. Efficiency in heat removal and dissipation is another difficulty that arises because amplifiers or other components are suspended over a substrate on metal bumps that serve as thermal standoffs. Using a flip-chip device and a low-loss substrate is a typical design strategy.

GLOBAL THERMAL COPPER PILLAR BUMP MARKET REPORT COVERAGE:

This research report on the global Thermal Copper Pillar Bump Market has been segmented and sub-segmented based on Packaging Technology, Vertical, and region.

Thermal Copper Pillar Bump Market – By Packaging Technology

• 3D IC

• 2.5D IC

• 2D IC

Based on Packaging Technology, the Thermal Copper Pillar Bump market is bifurcated into 2.5D IC, 2D IC, and 3D IC. Using copper pillars instead of conventional solders has additional benefits, such as increased input-output density, enhanced thermal conductivity, and improved electromigration resistance.AMD will be the first manufacturer to introduce copper hybrid bonding-capable chips in August 2021. This cutting-edge die-stacking technology enables the next generation of 3D-like devices and packages. In contrast to current chip-stacking interconnect systems, hybrid bonding links, and stacks chips utilizing microscopic copper-to-copper interconnects, which offer increased density and bandwidth. The connectivity systems in the package for Intel's 3D CPU, HBM, and other chips use minute copper micro bumps and a flip-chip technique. To improve the overall performance of the electronic gadget and support the market's growth, copper pillar bumping technology is thus constantly evolving.

Thermal Copper Pillar Bump Market – By Vertical

• Electronics

• Healthcare

• Automotive and Transport

• IT and Telecommunication

• Aerospace and Defense

• Others 

Based on End User, the Thermal Copper Pillar Bump market is segmented into Electronics, Industrial, Automotive, IT & Telecom,  Aerospace & Defense, Healthcare & Life Sciences, and Others. In terms of application, the military & defence sectors accounted for a sizable portion of the Flip Chip market in 2021. This is due to the demand for automated weapons, sophisticated security measures, and portable and small military equipment. This is a result of the increased use of automated security systems, sensor technologies, and cutting-edge weapons and ammunition. As a result, flip-chip technology is required for military computing platforms. The necessity to cool down components to lower temperatures for military needs has prompted the development of an indium micropump-based technology. Flip chips are therefore frequently used because of their high-frequency operations. Qorvo, a semiconductor company, said in May 2020 that it had signed a new contract with the United States Department of Defense (DoD). The objective is to advance the technological advancement of copper-pillar-on-GaN flip-chips. Thus, expanding research and applications in the military and defence sectors contribute to the expansion of the flip-chip industry.

Thermal Copper Pillar Bump Market - By Region:

• North America

• Europe

• Asia-Pacific

• Rest of the World

Asia Pacific Thermal Copper Pillar Bump Market is anticipated to expand quickly during the forecast period. The consumer electronics industry accounts for the majority of the demand for Thermal Copper Pillar Bump. 37% of the global market was accounted for by the APAC (Asia-Pacific) region in 2021. This is a result of the wide availability of raw materials in Asian nations and the expansion of research into MEMS and system-on-a-chip (SoC) technologies for flip chips. The market for flip chips is expanding due to causes including rising research into micro electrical mechanical systems (MEMS) technologies, rising demand for portable and compact circuit devices, and the requirement for higher frequency data transmission between devices.

Major Key Players in the Market

1. Shinko Electric Industries Co., LTD.

2. 3M Company

3. Amkor Technology, Inc.

4. Advanced Micro Devices, Inc.

5. Fujitsu Limited

6. Taiwan Semiconductor Manufacturing Company 

Notable happenings in the Global Thermal Copper Pillar Bump Market in the recent past:

• Expansion- In March 2022, Samsung Electro-Mechanics and LG Innotek, two of the major producers of IT components in Asia-Pacific, announced plans to expand new markets with a next-generation semiconductor packaging substrate known as flip chip ball grid array, increasing investment in this area to compete against Japanese and Taiwanese rivals.

• Expansion- In November 2021,  Amkor Technology Inc., a top supplier of semiconductor packaging and test services announced the construction of a cutting-edge smart factory in Bac Ninh, Vietnam. The new factory's initial phase will be devoted to offering cutting-edge system in package (SiP) assembly and test solutions to the top semiconductor and electronic manufacturing firms across the world.